CPS Technologies Corporation

AlSiC materials for electronic thermal management and packaging solutions

AlSiC Thermal Management, Microprocessor Lids, Flip Chip Lids, Heat Sinks, Microwave Housings, Optoelectronic Housings, Power Substrates, IGBT Baseplates, Liquid Cold Plates, Uninterruptible Power Supplies, MMC


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CPS Technologies Corporation
formerly Ceramics Process Systems
111 South Worcester Street
Norton MA,  02766

voice (508) 222-0614

fax (508) 222-0220

e-mail

DUNS # 12-099-8661
CAGE Code 46613
certified to ISO 9001:2000 standard
 

update 052009

copyright 2009


CPS is the World Leader in providing AlSiC thermal management materials and electronic packaging designs and products for the microelectronics and power electronics industries.  Applications include pin fin coolers for IGBT modules in Hybrid Electric Vehicles; Motor Control (Controller) power modules, Hi-Rel DC/DC converters, High Voltage Power Factor Correction (PFC) front ends; Uninterruptible Power Supplies (UPS), and many others.

flipchip lids AlSiC Flip Chip Microprocessor or ASIC Lid

optoelectronics AlSiC Optoelectronic Packaging

IGBT baseplates AlSiC IGBT Baseplates and Power Substrates

microwave packaging AlSiC Microwave Packaging

power substrates AlSiC Power Substrates

coolers AlSiC IGBT Coolers for HEV Applications

2009 SHOWS
November 1 - 5 IMAPS 2009 42nd International Symposium on Microelectronics San Jose Convention Center - San Jose, California, USA


AlSiC Thermal Management, Microprocessor Lids, Flip Chip Lids, Heat Sinks, Microwave Housings, Optoelectronic Housings, Power Substrates, IGBT Baseplates, Liquid Cold Plates, Uninterruptible Power Supplies, MMC