CPS - AlSiC materials for electronic thermal management and packaging solutions

CPS is the World Leader in providing AlSiC thermal management materials and electronic packaging designs and products for the microelectronics and power electronics industries.

flipchip lids

optoelectronics

IGBT baseplates

microwave packaging

power substrates

coolers

2008 Shows

15-Sep	Digital Power Forum 2008 - San Francisco, CA
14-Oct	iMAPS Advanced Technology Workshop on Thermal Management - Palo Alto, CA
15-Oct	The International Wafer-Level Packaging Congress (IWLPC) - San Jose, CA
3-Nov	2008 ASME Congress - Boston MA
4-Nov	iMAPS 2008 The 41st International Symposium on Microelectronics - Providence RI
11-Nov	Power Systems Conference - Seattle WA
13-Nov	MEPTEC - Emerging Package Solution Technologies - San Jose, CA
14-Nov	IEEE Phoenix Section Emerging Device and Packaging Technologies - Phoenix AZ
2-Dec	Electric Drive Transportation Association - Washington DC

AlSiC Thermal Management, Microprocessor Lids, Flip Chip Lids, Heat Sinks, Microwave Housings, Optoelectronic Housings, Power Substrates, IGBT Baseplates, Liquid Cold Plates